Semiconductor Packaging News
Design And Verification Issues In 2024 This year's EDA trends highlight challenges in design and verification, with top stories focusing on shifts toward system-centric design, AI’s expanding role in chip design, and questions about asynchronous logic's relevance.
Semiconductor Packaging News
TSMC Starts Equipment Installation for 2nm Fab TSMC launched its first 2-nanometer fab in Kaohsiung six months ahead of schedule, signaling robust global demand for advanced chips.
Semiconductor Packaging News Index
Unpacking AI's Power-Hungry Demands Mike Ranjram, an ASU professor, addressed power delivery challenges in AI at IMAPS 2024, emphasizing AI's surging power demands.
Advanced Packaging: The Intensifying Strategic Game
5 days ago · The semiconductor industry is advancing with cutting-edge packaging technologies like 2.5D/3D, Chiplet, and FOWLP, delivering superior performance and integration. These innovations address AI, 5G, and HPC demands, reshaping competition and fueling rapid technological progress ...
Semiconductor Packaging News
Three years on: Has India found its footing in the semiconductor industry? India launched an ambitious push into the global semiconductor industry on December 15, three years ago, aiming to break a seven-decade struggle.
Wafer Shipments Remain Soft in 2024 Before Strong Expected …
Global silicon wafer shipments are projected to decline by 2% in 2024 but will rebound with a 10% growth in 2025. Rising demand for AI and advanced processing, along with new applications in packaging and memory, will drive growth through 2027 ...
Semiconductor Packaging News
Qualcomm's interest in Intel cools Qualcomm has paused its interest in acquiring Intel due to financial, regulatory, and operational complexities, including Intel's $50 billion debt and unprofitable semiconductor unit.
Advanced Packaging Driving New Collaboration Across Supply Chain
The semiconductor industry's shift to advanced packaging, including chiplets and heterogeneous integration, fuels innovations in AI, 5G, and automotive fields. Industry leaders stress that collaboration is crucial to meet performance demands and tackle complex challenges ...
Semiconductor Packaging News Technical Paper Index
Dec 12, 2024 Ultrasonic Bonding in semiconductor industry – The fast and clean process Ultrasonic die bonding revolutionizes semiconductor assembly with rapid processing, strong bonds, and low thermal stress.
CHIPS Subsidy Boosts Advanced Packaging in U.S.
A $1.6 billion CHIPS Act subsidy aims to boost U.S. advanced-packaging capacity. Taiwan's ASE and others double California capacity to support AMD, Apple, and Nvidia. The U.S. Department of Commerce launches a competition to spur R&D in energy-efficient tech ...