Virginia Tech team develop new kind of circuit board that can heal and be reshaped, potentially solving the world's growing e-waste problem.

Abstract: An efficient microwave network method is proposed for signal and power integrity analysis of a multilayer printed circuit board with multiple vias and decoupling capacitors. The multilayer ...

On May 30–31, 2025, the Re charge ceramics exhibition opened at the University of Tokyo’s Komaba Research Campus, ...

Abstract: This paper addresses the evaluation of the heat transfer capability of a finned frame for different velocities of the cooling fan and different numbers and dimensions of the fins. As the ...

May 12, 2025 — A team engineers created a twisty high-temperature heat exchanger that outperformed a traditional straight channel design in heat transfer, power density and effectiveness and ...