Indium Corporation will feature its high-reliability, gold (Au)-based precision die-attach preforms for critical laser and ...

Gold tin solder in the packaging of high-power LED chip is mainly used in chip bonding technology and chip-level packaging technology, its role is to connect the chip with the substrate or lead to ...

This compatibility with solder pastes is achieved by a well-engineered miscibility between epoxy and no-clean solder paste flux systems, and is further assured with the introduction of a venting ...

A reflow profile with a high ramp-up rate or a too-rapid temperature increase can lead to solder splattering and formation of solder balls. If the temperature increases too quickly, the flux may not ...

It was measured whether changing the amount of bismuth in the solder paste changed the amount of voids in the component solders. Standard electronic components were examined and analyzed to obtain an ...