Die cracking, solder joint fatigue, warpage, and delamination are just a few of the possible mechanical failures.

U.S. companies captured 54% of the total worldwide IC market in 2021, propelled by a 47% share of IDM sales and a 68% share of fabless sales. April 5, 2022 -- Regional marketshares of IDMs (companies ...

Abstract: This paper presents a new electrical-based stress model that addresses the stress effect in the nanometer CMOS devices. As such ... technique is applied in the reference circuit design.

Abstract: A new generation of wireless transceivers is being intergrated into CMOS IC technology, which so far has been used mainly to realize digital and mixed analog-digital baseband circuits. This ...