The Biden administration launched a Section 301 probe into Chinese legacy semiconductors, citing non-market practices that harm competition and create supply chain risks. The investigation may lead to ...

The Cutting-Edge Design Scheme Behind HBM3E's Success: Summary SK hynix launched its HBM3E chip, pioneering a 6-phase RDQS scheme. This innovation enhances ...

TSMC's Wafer Manufacturing 2.0 Reshapes Advanced Packaging Market: Summary TSMC's "Wafer Manufacturing 2.0," launched in July 2024, integrates packaging, testing, and photomask pr ...

Advances in vapor chamber technology revolutionize thermal management, delivering up to 12.5°C cooler performance than copper spreaders. These integrated chambers now enhance efficiency in smartphones ...

Veeco Instruments Inc. announced that PlayNitride, an industry leader in MicroLED technology, has qualified Veeco's Lumina® MOCVD system for production ... Veeco Instruments Inc. We search for ...

Littelfuse, Inc. announced the launch of its TPSMB Asymmetrical TVS Diode Series, the first-to-market asymmetrical transient voltage suppression (TVS) diode specifically ...

Summary Intel’s Sanjay Natarajan explores Moore’s Law’s transformative history, emphasizing its focus on cost reduction rather than just transistor doubling. He highlights its role in advancing global ...

Summary The Biden administration launched a probe into Chinese-made legacy semiconductors, citing national security risks and unfair subsidies. The investigation may lead to tariffs or import ...

AI Technology (AIT) is pleased to announce the successful completion of its acquisition of Ormet Circuits Inc. (Ormet) from EMD Electronics, the U.S. and Canada Electronics ... AI Technology, Inc.

Samsung Electronics and Texas Instruments finalized agreements for billions in US government funding under the CHIPS Act, boosting domestic semiconductor production. Samsung will receive $4.75 billion ...

Master Bond Supreme 121AOND is a toughened epoxy system for bonding and sealing applications. It is a two component, heat curing system with a thixotropic paste consistency. ... Developed for medical ...

SiC devices, including Schottky diodes and MOSFETs in TSPAK and TOLT packages. TSC reduces thermal resistance by 17%-19%, enhances performance, cuts costs, and minimizes EMI. Ideal for power-dense, ...