LiquidStack, a specialist in liquid cooling for data centres, has unveiled its new GigaModular CDU at this year’s Datacloud ...

At this year’s 2025 IEEE International Interconnect Technology Conference (IITC), imec has presented Ru lines at a 16nm pitch ...

Huawei has been actively developing its domestic chip supply chain and enhancing its technological capabilities and is said ...

Anglia Components has signed an agreement to support and supply a full range of legacy and new memory products.

AccelerComm the developer of advanced 5G technology for satellite networks, has closed a funding round totalling $15m.

The UK Electronics Skills Foundation (UKESF) has announced the launch of the Semiconductor: Skills, Talent and Education ...

Space businesses are queueing up to get payloads into space. Others are looking to clean up the mess they leave behind.

Infineon unveils new family of radiation hardened Gallium Nitride (GaN) transistors, based on its CoolGan technology.

"Advanced packaging is one of the primary vehicles for advancing compute density in AI clusters and cloud," said Will Chu, ...

Yokogawa has announced the release of the SL2000 High-Speed Data Acquisition Unit, a ScopeCorder series product.

SEGGER’s line of J-Link debug probes can now be used to both download a program into and debug Allegro MicroSystems MCUs.

AMD acquires photonics specialist Enosemi in a move that’s intended to boost its co-packaged optics capabilities.