Gold tin solder in the packaging of high-power LED chip is mainly used in chip bonding technology and chip-level packaging technology, its role is to connect the chip with the substrate or lead to ...

Comparison: Ordinary solder paste climbing tin height less than 25%, dedicated solder paste up to 85% ~ 99%. Flux paste assistance: In the QFN side or PCB pad coated with flux paste after the second ...

Indium Corporation will feature its high-reliability, gold (Au)-based precision die-attach preforms for critical laser and ...

Aluminum brazing flux paste can work together with aluminum or zinc based brazing filler metals on aluminum, aluminum alloy, copper alloy at the temperature range of 450-600°C in frame brazing, ...