Hi, I'm Bill. I'm a software developer with a passion for making and electronics. I do a lot of things and here is where I ...
Hi, I'm Bill. I'm a software developer with a passion for making and electronics. I do a lot of things and here is where I document my learning in order to be able to inspire other people to make ...
Stacking dies introduces layers of complexity driven by multi-physics interactions, which must be addressed at the start of ...
Abstract: PCB Litz wire is a promising method to solve the high eddy loss issue in PCB windings. However, it suffers from high DC conduction loss due to the existing 2-layer integration style and poor ...
Avoiding via failures caused by barrel plating separation. PCB manufacturers face challenges in the precise registration of multiple layers, which is required to ensure reliable interconnects, and in ...
True 3-D interconnects and packaging. Rigid PCBs are inherently 2-D. Rigid-flex, however, allows you to fold, bend and twist ...
Abstract: PCB inductors can enhance the integration of power electronics systems and hence are in high demand. Nevertheless, PCB inductors encounter challenges, such as the severe skin effect and ...