Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) and US-based artificial intelligence (AI) chip designer Nvidia Corp have partnered with each other on silicon photonics development, Nvidia founder and CEO Jensen Huang (黃仁勳) said.

CEO Jensen Huang confirmed its advanced packaging needs from Taiwan Semiconductor Manufacturing Company (NYSE:TSM) are changing, according to a report by Reuters. Blackwell, Nvidia's latest artificial intelligence chip,

Nvidia is moving the production of its Blackwell chips from TSMC's CoWoS-S to CoWoS-L advanced packaging technology.

Nvidia CEO Jensen Huang Huang said he will be celebrating Lunar New Year with employees.

Meanwhile, a slew of other tech executives including Elon Musk, Jeff Bezos and Mark Zuckerberg are reportedly set to attend the events on Monday.

NVIDIA CEO Jensen Huang says his company is working with TSMC to create new opportunities in robotics and autonomous vehicles, will fight Tesla.

TSMC is advancing its compact optical engine technology, branded as COUPE, a top priority among its emerging innovations. Nvidia CEO Jensen Huang, during a recent visit to Taiwan, highlighted collaboration with TSMC on silicon photonics,

Last week, Jensen Huang, CEO of NVIDIA, visited Taiwan and met with high-ranking officials from Taiwanese partners, including Wei Zhe Zha, CEO of TSMC. They reportedly focused on seeking technological collaboration for NVIDIA's artificial intelligence (AI ...

Aside from being industry partners for several decades, it seems that Nvidia CEO Jensen Huang and TSMC Chairperson CC Wei built a friendship — something rarely seen by the public. Although ...

NVIDIA's demand for advanced packaging from TSMC, but the tech it needs is changing: Jensen Huang says NVIDIA will transition to CoWoS-L packaging.

At CES 2025, Jensen Huang declared it is now the "ChatGPT moment for robotics," as Nvidia intensifies its development of robotics technology to build a comprehensive robotics ecosystem..

Nvidia CEO Jensen Huang confirms changes in advanced packaging needs at TSMC, opting for CoWoS-L over CoWoS-S for upcoming Blackwell chip.