TSMC's Wafer Manufacturing 2.0 Reshapes Advanced Packaging Market: Summary TSMC's "Wafer Manufacturing 2.0," launched in July 2024, integrates packaging, testing, and photomask pr ...

The Biden administration launched a Section 301 probe into Chinese legacy semiconductors, citing non-market practices that harm competition and create supply chain risks. The investigation may lead to ...

The Cutting-Edge Design Scheme Behind HBM3E's Success: Summary SK hynix launched its HBM3E chip, pioneering a 6-phase RDQS scheme. This innovation enhances ...

Advances in vapor chamber technology revolutionize thermal management, delivering up to 12.5°C cooler performance than copper spreaders. These integrated chambers now enhance efficiency in smartphones ...

Summary Intel’s Sanjay Natarajan explores Moore’s Law’s transformative history, emphasizing its focus on cost reduction rather than just transistor doubling. He highlights its role in advancing global ...

Samsung Electronics and Texas Instruments finalized agreements for billions in US government funding under the CHIPS Act, boosting domestic semiconductor production. Samsung will receive $4.75 billion ...

Summary The Biden administration launched a probe into Chinese-made legacy semiconductors, citing national security risks and unfair subsidies. The investigation may lead to tariffs or import ...

SiC devices, including Schottky diodes and MOSFETs in TSPAK and TOLT packages. TSC reduces thermal resistance by 17%-19%, enhances performance, cuts costs, and minimizes EMI. Ideal for power-dense, ...

US plans to blacklist company that ordered TSMC chip found in Huawei processor: Summary The Biden administration plans to blacklist Sophgo, a Chinese company tied to Huawei's AI-c ...

DENSO CORPORATION and onsemi announced that they are strengthening their long-term relationship to support the procurement of autonomous driving (AD) and advanced ... Semiconductor Packaging News is ...

Further to sureCore's recent announcement about its launch of a range of cryogenic IP following the successful evaluation of test chips in both 180 nm and 22nm process nodes, ...

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