Formulated for electrical potting and encapsulation applications, Master Bond EP36AO combines high thermal conductivity with thermal stability. This flexible, heat resistant epoxy has superior ...

The temperature was controlled ... There are various candidate epoxy molecules for thermoset resin of high thermal conductivity. Our present mesogenic structure was limited to the biphenyl type ...

As the focus on energy resiliency and competitiveness increases, the development of advanced materials for next-generation, ...

EP21TDC-2LO has a thermal conductivity of 9 Btu/in ... over 90 min of work life (for a 100-gm mass), and cures at room temperatures or more rapidly with heat to 36 Shore D hardness.

A new two-part adhesive system is said to offer thermal conductivity in excess of 22 BTU-in./ft.2-hr.-°F. The EP21AN epoxy adhesive ... cures readily at ambient temperatures or more quickly ...

In the core process of chip manufacturing, aluminum nitride ceramic structural components bear the dual mission of thermal ...

Master Bond Supreme 121AOND is a toughened epoxy system ... profile even at high temperatures with a tensile modulus of ...

However, conventional one-component epoxies are only stable at room temperature (below 25°C), limiting their storage under high-temperature ... electrical conductivity and thermal stability.

Based on nano-silver technology, Kyocera’s Silver Sinter Paste demonstrates a thermal conductivity ... temperature, pressureless silver solder option that enhances the performance of high ...

which significantly lowers its thermal conductivity. Wafer-scale 3C-SiC bulk crystals produced by Air Water Inc. were grown by low-temperature chemical vapor deposition and had high crystal ...