Formulated for electrical potting and encapsulation applications, Master Bond EP36AO combines high thermal conductivity with thermal stability. This flexible, heat resistant epoxy has superior ...

EP21TDC-2LO has a thermal conductivity of 9 Btu/in ... over 90 min of work life (for a 100-gm mass), and cures at room temperatures or more rapidly with heat to 36 Shore D hardness.

A new two-part adhesive system is said to offer thermal conductivity in excess of 22 BTU-in./ft.2-hr.-°F. The EP21AN epoxy adhesive ... cures readily at ambient temperatures or more quickly ...

Promising high flexibility and thermal conductivity, the EP21TDC-2LO epoxy resin cures at room temperatures, more rapidly at elevated temperatures, and has a 1-to-3 mix ratio by weight or volume.

Master Bond Supreme 121AOND is a toughened epoxy system ... profile even at high temperatures with a tensile modulus of ...

EP21ND Two part, room temperature curing epoxy. Convenient 1:1 mix ratio ... Many of these compounds have unique properties such as low thermal expansion coefficients, exceptionally high thermal ...

The temperature was controlled ... There are various candidate epoxy molecules for thermoset resin of high thermal conductivity. Our present mesogenic structure was limited to the biphenyl type ...

However, conventional one-component epoxies are only stable at room temperature (below 25°C), limiting their storage under high-temperature ... electrical conductivity and thermal stability.

In the core process of chip manufacturing, aluminum nitride ceramic structural components bear the dual mission of thermal ...