Harvard and Northwestern researchers combine AI and physics to design unstable proteins that comprise the dark proteome.
As semiconductor technologies advance, device structures are becoming increasingly complex. New materials and architectures introduce intricate physical effects requiring accurate modeling to ensure ...
A new technical paper titled “DiffChip: Thermally Aware Chip Placement with Automatic Differentiation” was published by researchers at MIT and IBM. “Chiplets are modular integrated circuits that can ...
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